Revasum designs, manufactures and markets a portfolio of semiconductor processing equipment (also known as ‘systems’). The systems that Revasum manufactures are an integral part of the production chain in manufacturing and processing wafers sized 200mm and below. These wafers are used to make microchips, sensors, LEDs, RF devices and power devices, commonly used in connected IoT devices, mobile phones, wearables, automotive, 5G and industrial applications.

Revasum is headquartered in San Luis Obispo, California, United States, and has both direct and independent sales and service offices located in the United States (Eastern Seaboard), China (including contract manufacturing), Europe, Japan, Korea and Taiwan. Revasum, Inc. is legally incorporated in Delaware, United States.

The Company’s product portfolio includes grinding, polishing and chemical mechanical planarization (CMP) systems used to manufacture substrates and devices for the global semiconductor industry. Revasum plans to continue to expand its product offering and is currently developing a new substrate polishing system and a new CMP system.